Reconfigurable semiconductor device

ABSTRACT

A reconfigurable semiconductor device is disclosed. The semiconductor device includes a substrate, a first insulating material formed on the substrate, two channels having different polarities, a plurality of terminal electrodes formed on the insulating material and coupled in common with the channels at their opposite ends, a second insulating material formed on the terminal electrodes, and a control gate formed on the second insulating material. The channels have different polarity and a charge storage layer is formed inside the second insulating material. The control gate is applied with a forward bias or a reverse bias and then the bias is cut off. The voltage-current characteristics of the semiconductor device are changed according to an electrical charge created in the charge storage layer.

TECHNICAL FIELD

The described technology relates generally to semiconductors and, moreparticularly, to a reconfigurable semiconductor device and a method ofmanufacturing the same.

BACKGROUND

A wide variety of semiconductor devices are currently available.

Semiconductor devices are typically composed of materials that have hadtheir electrical characteristics altered by the addition of impurities.If an electrical signal is applied to a semiconductor device, it willoperate predictably according to the electrical properties of thematerials included in the semiconductor device.

Semiconductor devices can be classified as diodes, Bipolar JunctionTransistors (BJT), or Field Effect Transistors (FET), according to thesemiconductor material components, the layer structure of thesemiconductor material, and the operational characteristics.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a semiconductor device according to oneembodiment.

FIG. 2 is a cross sectional view based on a cross section A-A of thesemiconductor device of FIG. 1.

FIG. 3 is a cross sectional view based on a cross section B-B of thesemiconductor device of FIG. 1.

FIGS. 4( a)-4(e) are cross sectional views based on a cross section C-Cof the semiconductor device of FIG. 1.

FIGS. 5( a)-5(c) are graphs illustrating a voltage-currentcharacteristic of the semiconductor device of FIG. 1.

FIG. 6 is a diagram illustrating the polarity of electrical chargeaccumulated in each layer when a forward bias is applied to a gate ofthe semiconductor device of FIG. 1.

FIG. 7 is a diagram illustrating a bias cut off after applying a forwardbias to a gate of the semiconductor device of FIG. 1.

FIG. 8 is a graph illustrating the change in the characteristics betweena gate and a channel of the semiconductor device of FIG. 1.

FIG. 9 is a diagram illustrating the polarity of electrical chargeaccumulated in each layer when a reverse bias is applied to a gate ofthe semiconductor device of FIG. 1.

FIG. 10 is a diagram illustrating cutting off the bias to a gate of thesemiconductor device of FIG. 1.

FIG. 11 is a graph illustrating the change in the characteristicsbetween a gate and a channel of the semiconductor device of FIG. 1.

FIGS. 12( a) and 12(b) are graphs illustrating voltage-currentcharacteristics of the semiconductor device of FIG. 1.

FIG. 13 is a perspective view of a semiconductor device according toanother embodiment.

FIGS. 14( a) and 14(b) are graphs illustrating a voltage-currentcharacteristic of the semiconductor device of FIG. 13.

FIG. 15 is a flow diagram illustrating a method of manufacturing asemiconductor device in one embodiment.

FIG. 16 is a diagram illustrating a process of manufacturing asemiconductor device in another embodiment.

DETAILED DESCRIPTION

A semiconductor device having improved electrical characteristics andwhich may be used for various purposes is provided. The semiconductordevice according to the various embodiments of the present disclosure isa device having reconfigurable electrical characteristics. Accordingly,the electrical characteristics of the semiconductor device can becontrolled as desired.

Hereinafter, the semiconductor device and a method of manufacturing thesame according to an example embodiment of the present disclosure aredescribed. The figures attached to the present disclosure are for theconvenience of explanation and the shapes of layers, electrodes andmembers may be exaggerated or abridged.

FIG. 1 is a perspective view of the semiconductor device according toone example embodiment. FIG. 2 is a cross sectional view based on across section A-A of the semiconductor device of FIG. 1. FIG. 3 is across sectional view based on a cross section B-B of the semiconductordevice of FIG. 1.

As illustrated, the semiconductor device of FIG. 1 to FIG. 3 includes afirst gate 110, a substrate 120, a first insulating layer 130, a firstchannel 140, a second channel 150, terminal electrodes 161 and 162,second insulating layers 170A and 170B, a charge storage layer 180 and asecond gate 190.

The first gate 110 and the second gate 190 are electrodes supplied withan external power source. If the first gate 110 and/or the second gate190 are supplied with a power source, the semiconductor device of FIG. 1may have an electrical field applied to it by the externally suppliedpower source.

The first gate 110 and the second gate 190 may be formed with variousmaterials. For example, the gates may be formed with metallic materialssuch as gold (Au) or may be formed with polymers such as poly silicon.The first gate 110 and the second gate 190 may be formed with the samematerial or may be formed with different materials. The first gate 110and the second gate 190 may be called by various names such as top gate,back gate, and so on, according to the installed location of the gate.Moreover, the gate may be called a control gate if it is used forcontrol and may be called an operating gate if it is used for operationslike amplification or switching.

The substrate 120 is formed on the first gate 110. The substrate 120 maybe a doped n-type or p-type semiconductor substrate, or may be anun-doped semiconductor substrate.

The first insulating layer 130 is formed on the substrate 120.

Two or more channels 140 and 150 and two or more terminal electrodes 161and 162 are provided on the first insulating layer 130. The terminalelectrodes 161 and 162 are coupled in common with the channels 140 and150 at their opposite ends.

The channels 140 and 150 may be a semiconductor layer having a firstpolarity and a semiconductor layer having a second polarity. Forexample, the first channel 140 may be a p-type doped silicon film andthe second channel 150 may be an n-type doped silicon film. As anotherexample, the first channel 140 may be a p-type doped nanowire, and thesecond channel 150 may be an n-type doped nanowire. The nanowire may befabricated from various materials such as, by way of example, Si, Ge,ZnO, GaAs, GaP, GaN, CdSe, InO, InP, SnO, CdTe, BaSrO, V₂O₅ and thelike. The channels 140 and 150 may be fabricated from the same materialor from different materials.

Any one of the first terminal electrode 161 and the second terminalelectrode 162 may be a source electrode and the other may be a drainelectrode. The terminal electrodes 161 and 162 may be fabricated fromgold or titanium.

Second insulating layers 170A and 170B are formed on the terminalelectrodes 161 and 162 and on the channels 140 and 150. Further, thecharge storage layer 180, which is capable of storing an electricalcharge, may be formed inside the second insulating layers 170A and 170B.The charge storage layer 180 may be in a location corresponding to thechannels 140 and 150. Since the charge storage layer 180 is formedinside the second insulating layers 170A and 170B, the charge storagelayer 180 is insulated from the second gate 190, and the channels 140and 150. That is, the charge storage layer 180 is electrically floated.

The second insulating layers 170A and 170B may be divided into a lowerinsulating sub-layer (e.g., second insulating layer 170A) and an upperinsulating sub-layer (e.g., second insulating layer 170B). Hereinafter,the lower insulating sub-layer may be called the second insulating layerand the upper insulating sub-layer may be called the third insulatinglayer.

The charge storage layer 180 may be formed on the lower insulatingsub-layer. Since the lower insulating sub-layer is relatively thin, thecharge storage layer 180 may be charged due to a tunneling phenomenon ifa bias is applied to the second gate 190.

The second gate 190 is formed on the upper insulating sub-layer. Thesecond gate 190 is insulated from the charge storage layer 180, and thechannels 140 and 150.

FIGS. 4( a)-4(e) are cross sectional views based on a cross section C-Cof the semiconductor device of FIG. 1. In particular, FIG. 4( a)illustrates one example of a layered structure of the semiconductordevice. As shown in FIG. 4( a), two or more charge storage layers 180Aand 180B may be provided. In this case, one charge storage layer 180Amay be located to correspond with the first channel 140 and the othercharge storage layer 180B may be located to correspond with the secondchannel 150.

FIG. 4( b) through FIG. 4( e) illustrate a layered structure of asemiconductor device according to other embodiments of the presentdisclosure. First of all, as shown in FIG. 4( b), a charge storage layermay be one planar member. In this case, the charge storage layer 180 maybe formed in a size large enough to correspond with both the firstchannel 140 and the second channel 150.

Further, as shown in FIG. 4( c), the charge storage layer 180 may be aregion including a plurality of conductive particles. For example, theplurality of conductive particles may be nanoparticles. When the chargestorage layer 180 includes a plurality of conductive particles, eachconductive particle may store electrical charge. If electrical charge isstored by a plurality of conductive particles, then, even if a leakoccurs, all of the electrical charge does not leak at once.

Further, as shown in FIG. 4( d), the charge storage layer 180 may be aregion including a plurality of conductive particles and the channels140 and 150 may include at least one nanowire. Further, as shown in FIG.4E, the charge storage layer 180 may be one planar member and thechannels 140 and 150 may include at least one nanowire.

As described hereinabove, the terminal electrodes 161 and 162 arecoupled in common not only with the first channel 140 of first polaritybut also with the second channel 150 of second polarity at theiropposite ends. Accordingly, the semiconductor device of FIG. 1 has bothof the different electrical characteristics generated by the channels140 and 150 of first polarity and second polarity.

For example, if the first channel 140 is a p-type nanowire orsemiconductor layer and the second channel 150 is an n-type nanowire orsemiconductor layer, a voltage-current characteristic of thesemiconductor device may be similar to that shown in FIGS. 5( a)-5(c),which is further described below.

FIGS. 5( a)-5(c) are graphs illustrating a voltage-currentcharacteristic of the semiconductor device of FIG. 1. FIG. 5( a)illustrates a voltage-current characteristic between a first gatevoltage V_(G) applied to the first gate 110 and the p-type first channel140. The voltage-current characteristics shown in FIG. 5A correspond toa conventional p-type Field Effect Transistor (FET). As shown in FIG. 5(a), if the absolute value of a reverse bias applied to the first gate110 does not reach a critical value, the current I_(M1) does not flowthrough the p-type first channel 140. However, if the absolute value ofa reverse bias applied to the first gate 110 exceeds the critical value,the current I_(M1) flows through the p-type first channel 140.

Meanwhile, FIG. 5( b) illustrates a voltage-current characteristicbetween a first gate voltage V_(G) applied to the first gate 110 and then-type second channel 150. The voltage-current characteristics shown inFIG. 5( b) correspond to a conventional n-type Field Effect Transistor(FET). As shown in FIG. 5( b), if a forward bias applied to the firstgate 110 is less than a critical value, the current I_(M2) does not flowthrough the n-type second channel 150. However, if the absolute value ofa forward bias applied to the first gate 110 exceeds the critical value,current I_(M2) flows through the n-type second channel 150.

Since the first channel 140 and the second channel 150 are coupled inparallel with the terminal electrodes 161 and 162, a finalcharacteristic of the current (I_(M)=I_(M1)+I_(M2)) flowing through theterminal electrodes 161 and 162 is like that shown in FIG. 5( c). Thatis, the semiconductor device of FIG. 1 may have the characteristics ofboth a p-type FET and an n-type FET.

The characteristics of the first gate voltage V_(G) and the currentI_(M) flowing through the terminal electrodes of the semiconductordevice according to one example embodiment of the present disclosure areadjustable by a forward/reverse bias applied to the second gate 190.Hereinafter, a method of adjusting the characteristics of first gatevoltage V_(G) and the current I_(M) of the semiconductor device throughadjusting the bias applied to the second gate 190 is described.

A first method of adjusting the characteristics of the first gatevoltage V_(G) and current I_(M) of the semiconductor device is applyinga forward bias to the second gate 190 and then cutting off the bias inorder to control the p-type channel characteristics.

FIG. 6 is a diagram illustrating the polarity of electrical chargeaccumulated in each layer when a forward bias is applied to a gate ofthe semiconductor device of FIG. 1. In particular, FIG. 6 illustratesthe polarity of electrical charge accumulated in each layer when aforward bias is applied to the second gate 190. When a forward bias isapplied to the second gate 190, negative electrical charge accumulatesin the charge storage layer 180 due to a tunneling phenomenon. Further,negative electrical charge also accumulates in the p-type first channel140 because of the strong external forward bias.

FIG. 7 is a diagram illustrating a bias cut off after applying a forwardbias to a gate of the semiconductor device of FIG. 1. As shown in FIG.7, when the external bias is not applied further through the second gate190, negative electrical charge is continuously stored in the chargestorage layer 180. However, positive electrical charge accumulates inthe p-type first channel 140 because of the negative electrical chargeremaining in the charge storage layer 180.

As illustrated in FIG. 6 and FIG. 7, when the application of bias is cutoff after an application of forward bias, the characteristics of thefirst gate voltage V_(G) and current I_(M1) change because of thenegative electrical charge stored in the charge storage layer 180. Thatis, the number of positive carriers in the first channel 140 isincreased due to an electrical field generated by the negativeelectrical charge stored in the charge storage layer 180, and thecharacteristics of the first gate voltage V_(G) and current I_(M1)change according to the change in the number of carriers.

FIG. 8 is a graph illustrating the change in the characteristics betweena gate and a channel of the semiconductor device of FIG. 1. Inparticular, FIG. 8 illustrates the change in the characteristics betweenthe first gate voltage V_(G) and the current I_(M1) flowing through thep-type first channel. If a forward bias is applied to the second gate190 and then cut off, the characteristics of the first gate voltageV_(G) and the current I_(M1) flowing through the first channel change asshown in FIG. 8. For example, the curve of the first gate voltageV_(G)-current I_(M1) is shifted from the first curve 801 to the secondcurve 802 according to the changed characteristics.

The extent that the first gate voltage V_(G)-current I_(M1) curve isshifted is determined by the amount of forward bias applied to thesecond gate 190. Therefore, if the amount of the forward bias applied tothe gate 190 is adjusted, the critical value of the gate electricalpotential at which the current I_(M1) through the first channel beginsto flow may be changed from V_(T1) to V_(T2).

It is generally true that the electrical potential of an FET device gateis determined for a preset region, namely over a predetermined operatingrange. Therefore, if the curve of the first gate voltage V_(G)-currentI_(M1) is shifted as shown in FIG. 8, an operation corresponding to thatof a conventional p-type enhanced-mode FET may be performed within theoperation range of the first gate 190.

Meanwhile, a reverse bias may be applied to the second gate 190 in orderto control the characteristics of a p-type channel. When the reversebias is applied to the second gate 190 and then cut off, the gatevoltage V_(G)-current I_(M1) curve of FIG. 8 is shifted to the leftside. When the reverse bias is applied to the second gate 190, positiveelectrical charge accumulates in the charge storage layer 180 andpositive electrical charge also accumulates in the p-type first channel140. Then, when the application of reverse bias is cut off, the positiveelectrical charge is continuously stored in the charge storage layer 180and the number of positive carriers in the first channel 140 isdecreased due to an electrical field generated from the charge storagelayer 180. Consequently, if the application of bias to the second gate190 is cut off after applying the reverse bias, the gate voltageV_(G)-current I_(M1) curve shown in FIG. 8 is shifted to the left sidesince the number of positive carriers in the first channel 140 isdecreased.

Hereinafter, a second method to adjust the V_(G)-I_(M) characteristic ofthe semiconductor device is described. The second method proposed in thepresent disclosure comprises applying a reverse bias to the second gate190 and then cutting off the bias in order to control thecharacteristics like that of an n-type channel.

FIG. 9 is a diagram illustrating the polarity of electrical chargeaccumulated in each layer when a reverse bias is applied to a gate ofthe semiconductor device of FIG. 1. In particular, FIG. 9 illustratesthe polarity of electrical charge accumulated in each layer when areverse bias is applied to the second gate 190. When the reverse bias isapplied to the second gate 190, positive electrical charge accumulatesin the charge storage layer 180 due to a tunneling phenomenon. Further,negative electrical charge also accumulates in the n-type second channel150 because of the strong external forward bias.

FIG. 10 is a diagram illustrating cutting off the bias to a gate of thesemiconductor device of FIG. 1. In particular, FIG. 10 illustrates astate of a bias cut off after applying a reverse bias. As shown in FIG.10, when the external bias is not applied further to the second gate190, positive electrical charge is continuously stored in the chargestorage layer 180. However, negative electrical charge accumulates inthe n-type second channel 150 because of the positive electrical chargeremaining in the charge storage layer 180.

As illustrated in FIG. 9 and FIG. 10, if the application of bias is cutoff after an application of reverse bias, the characteristics of thefirst gate voltage V_(G) and current I_(M2) change due to the positiveelectrical charge stored in the charge storage layer 180. That is, thenumber of negative carriers in the second channel 150 is increasedbecause of an electrical field generated by the positive electricalcharge stored in the charge storage layer 180, and the characteristic ofthe first gate voltage V_(G) and current I_(M2) changes according to thechange in the number of carriers.

FIG. 11 is a graph illustrating the change in the characteristicsbetween a gate and a channel of the semiconductor device of FIG. 1. Inparticular, FIG. 11 illustrates the change in the characteristicsbetween the first gate voltage V_(G) and the current I_(M2) flowingthrough the second channel of n-type. If a reverse bias is applied tothe second gate 190 and then cut off, the characteristics of the firstgate voltage V_(G) and the current I_(M2) flowing through the secondchannel change as shown in FIG. 11. For example, the first gate voltageV_(G)-current I_(M2) curve is shifted from a first curve 1101 to asecond curve 1102, according to the changed characteristics.

The extent that the first gate voltage V_(G)-current I_(M2) curve isshifted is determined by the amount of the reverse bias applied to thesecond gate 190. Therefore, when the amount of the reverse bias appliedto the gate 190 is adjusted, the critical value of the gate electricalpotential at which the current I_(M2) through the second channel beginsto flow may be reduced from V_(T3) to V_(T4).

If the curve of the first gate voltage V_(G)-current I_(M2) is shiftedas shown in FIG. 11, an operation corresponding to a conventional n-typeenhanced-mode FET may be performed within the operating range of thefirst gate 190.

Meanwhile, a forward bias may be applied to the second gate 190 in orderto control the characteristics of an n-type channel. When the forwardbias is applied to the second gate 190 and then cut off, the gatevoltage V_(G)-current I_(M2) curve of FIG. 11 is shifted to the rightside. When the forward bias is applied to the second gate 190, negativeelectrical charge accumulates in the charge storage layer 180 andnegative electrical charge also accumulates in the n-type first channel150. Then, when the application of the forward bias is cut off, thenegative electrical charge is continuously stored in the charge storagelayer 180 and the number of negative carriers in the second channel 150is decreased because of an electrical field generated in the chargestorage layer 180. Consequently, if the application of the bias is cutoff to the second gate 190 after applying the forward bias, the gatevoltage V_(G)-current I_(M2) curve of FIG. 11 is shifted to the rightside since the number of negative carriers in the second channel 150 isdecreased.

FIGS. 12( a) and 12(b) are graphs illustrating voltage-currentcharacteristics of the semiconductor device of FIG. 1. In particular,FIGS. 12( a) and 12(b) illustrate a voltage V_(G)-current I_(M) curve ofthe semiconductor device according to one example embodiment of thepresent disclosure. As described hereinabove, when the bias is cut offafter applying the forward bias to the second gate 190, the voltageV_(G)-current I_(M) curve is shifted to the right side as shown in FIG.12( a). Further, when the bias is cut off after applying the reversebias to the second gate 190, the voltage V_(G)-current I_(M) curve isshifted to the left side as shown in FIG. 12( b).

As described hereinabove, the extent that the first gate voltageV_(G)-current I_(M) curve is shifted is determined by an amount of abias applied to the second gate 190. Therefore, by adjusting an amountof forward bias, the semiconductor of the present disclosure may be usedas a conventional p-type FET device. Further, if it is desired todiscontinue an operation as a p-type FET device and to start anoperation as an n-type FET, the semiconductor device may be used as aconventional n-type FET device by applying a reverse bias and thencutting off the applied reverse bias.

Hereinafter, another embodiment different from the example embodimentdescribed hereinabove is described.

FIG. 13 is a perspective view of a semiconductor device according toanother embodiment. As illustrated, the semiconductor device of FIG. 13includes a first gate 1310, a substrate 1320, a first insulating layer1330, a first channel 1340, a second channel 1350, terminal electrodes1361 and 1362, second insulating layers 1370A and 1370B, and a chargestorage layer 1380. Further, the semiconductor device of FIG. 13includes at least two top gates on the second insulating layers 1370Aand 1370B. The at least two top gates may include a first top gate 1301corresponding with the first channel 1340 and a second top gate 1302corresponding with the second channel 1350. In the semiconductor deviceof FIG. 13, if the two top gates 1301 and 1302 are formed, theelectrical characteristics of the semiconductor device may be furtherimproved.

FIGS. 14( a) and 14(b) are graphs illustrating a voltage-currentcharacteristic of the semiconductor device of FIG. 13. In particular,FIGS. 14( a) and 14(b) illustrate improved electrical characteristics ofthe semiconductor device by using the two top gates is described in FIG.13. For example, if the first channel 1340 is a p-type semiconductorlayer or a nanowire, and the second channel 1350 is an n-typesemiconductor layer or a nanowire, the curve of the first gate voltageV_(G)-current I_(M) may be like a first curve 1400 illustrated in FIG.14( a).

According to the description hereinabove, when a forward bias is appliedthrough the first top gate 1301 and the application of the bias is cutoff, the left side of the first curve 1400 is shifted towards 1401.However, when a reverse bias is applied through the first top gate 1301and the application of the bias is cut off, the left side of the firstcurve 1400 is shifted towards 1402.

When the reverse bias is applied through the second top gate 1302 andthe application of the bias is cut off, the right side of the firstcurve 1400 is shifted towards 1403. However, when the forward bias isapplied through the second top gate 1302 and the application of the biasis cut off, the right side of the first curve 1400 is shifted towards1404.

Consequently, when the top gate is separated in two and applied withdifferent biases, the left and right parts of the first gate voltageV_(G)-current I_(M) curve may be independently controlled. If theforward bias is applied through the first top gate 1301 and the reversebias is applied through the second top gate 1302, and then the forwardand reverse biases are cut off, the first gate voltage V_(G)-currentI_(M) curve may be like that shown in FIG. 14( b). That is, when adifferent polarity bias is applied to the two top gates, an ambipolarcharacteristic as shown in FIG. 14( b) may be obtained.

FIG. 15 is a flow diagram illustrating a method of manufacturing asemiconductor device in one embodiment. Beginning in a block 1501, afirst insulating layer is formed on a substrate, and a self-assembledmonolayer (SAM) patterning is performed on the first insulating layer.In a block 1502, a first channel and a second channel are formed on thefirst insulating layer. In a block 1503, an electrode is coupled to thechannels. In a block 1504, a second insulating layer is formed on theelectrode and the channels. In a block 1505, a charge storage layer isformed on the second insulating layer. In a block 1506, a thirdinsulating layer is formed on the charge storage layer and a gateelectrode is formed on the third insulating layer.

FIG. 16 is a diagram illustrating a process of manufacturing asemiconductor device in another embodiment. FIG. 16( a) corresponds toblock 1501 of forming a first insulating layer on a substrate andperforming a self-assembled monolayer (SAM) patterning on the oxidefilm. Hereinafter, a semiconductor shown in FIG. 16( a) is described.First, the first insulating layer (e.g., an oxide film 1603) is formedon a semiconductor substrate 1602. Since the oxide film 1603 is locatedat the lowest end, it may be called the lower oxide film or lowerinsulating film. A first channel 1604 and a second channel 1605 areformed on the oxide film 1603. If the first channel 1604 and the secondchannel 1605 are formed by nanowires, the SAM patterning may beperformed on the oxide film 1603. Through the SAM patterning, nanowiresmay be adsorbed at a particular portion of the oxide film 1603 whilebeing prevented from being adsorbed at the remaining portion. Forexample, the adsorption of the nanowires can be prevented throughforming an Octadecyltrichlorosilane (OTS) molecular film on the oxidefilm 1603.

FIG. 16( b) corresponds to block 1502 of forming a first channel and asecond channel on the first insulating layer. A semiconductor shown inFIG. 16( b) is one embodiment which includes nanowires as its channels.In order to form an assembly of n-type nanowires on the oxide film 1603,the semiconductor device may be placed into an n-type nanowire solution.When the semiconductor device is placed in the n-type nanowire solutionwhile protecting the part on the oxide film 1603 where a p-type nanowireis to be assembled, the n-type nanowire is assembled at the intendedlocation. Further, when the semiconductor device is placed in a p-typenanowire solution while protecting the part on the oxide film 1603 wherean n-type nanowire is to be assembled, a p-type nanowire is assembled atthe intended location. An electrical potential may be applied in thenanowire solution in order to enhance the assembly. If a doped p-type orn-type channel is to be formed on the oxide film 1603, a first channel1604 and a second channel 1605 may be formed using a conventionalPhysical Vapor Deposition (PVD) or chemical vapor deposition (CVD)method instead of the former described method.

FIG. 16( c) and FIG. 16( d) respectively correspond to block 1503 offorming an electrode coupled to the channels and block 1504 of forming asecond insulating layer. Hereinafter, a semiconductor shown in FIG. 16(c) and a semiconductor shown in FIG. 16( d) are described. According toFIG. 16( c), terminal electrodes 1606 and 1607 coupled to the channels1604 and 1605 may be formed through a photolithography process afterforming the first channel 1604 and the second channel 1605. Afterforming the terminal electrodes 1606 and 1607, the second insulatinglayer (e.g., a thin oxide film 1610A shown in FIG. 16( d)) is formed onthe terminal electrodes 1606 and 1607 and the channels 1604 and 1605.

FIG. 16( e) corresponds to block 1505 of forming a charge storage layer.Hereinafter, a semiconductor shown in FIG. 16( e) is described. If thecharge storage layer 1611 includes nanoparticles, an OTS molecular filmis formed on the thin oxide film 1610A to prevent the adsorption ofnanoparticles. Nanoparticles are classified according to whether or notthey are easily adsorbed to an oxide film. If nanoparticles which arenot easily adsorbed to the oxide film are included,aminopropylethoxysilane (APTES) may be applied at a portion where thenanoparticles are formed. If the nanoparticles are surrounded bymaterials such as a COOH— chemical structure, the nanoparticles are noteasily adsorbed to the oxide film. In this case, the APTES may be usedas a linker molecule between the nanoparticles and the oxide film. Ifthe charge storage layer 1611 is a planar conductive member, the chargestorage layer may be formed by using a general floating gate fabricationprocess.

FIG. 16( f) corresponds to block 1506 of forming a third insulatinglayer on the charge storage layer and a gate electrode on the thirdinsulating layer. Hereinafter, a semiconductor shown in FIG. 16( f) isdescribed. The third insulating layer (e.g., a thick oxide film 1610B)is formed on the charge storage layer 1611 and the thin oxide layer1610A, and gate electrodes 1601 and 1620 are formed on the thick oxidefilm 1610B and below the substrate 1602 respectively.

The disclosed semiconductor device and the method of manufacturing thesame may be applied to various semiconductor devices and manufacturingmethods without departing from the basic concept of the presentdisclosure. Accordingly, all the disclosed embodiments must beunderstood as being exemplary only and must not be construed to be thelimit of the present disclosure. Accordingly, the range of protectionfor the present disclosure must be determined not by an embodimentdescribed hereinabove, but by the attached claims. An alternative thatis equivalent to the attached claims is included in the range ofprotection of the attached claims.

1. A semiconductor device comprising: an operating gate; a substrateformed on the operating gate; a first insulating layer formed on thesubstrate; a first channel having a first polarity that is formed at afirst planar position of the first insulating layer; a second channelhaving a second polarity that is formed at a second planar position ofthe first insulating layer; terminal electrodes coupled in common withthe first channel and the second channel at their opposite ends; asecond insulating layer formed on the channels and the terminalelectrodes; a charge storage layer floated inside the second insulatinglayer and chargeable with an electrical charge; and at least one controlgate formed on the second insulating layer.
 2. The semiconductor deviceof claim 1, wherein the charge storage layer is formed at a locationcorresponding with the first planar position and the second planarposition.
 3. The semiconductor device of claim 1, wherein the firstchannel is a p-type doped semiconductor layer and the second channel isan n-type doped semiconductor layer.
 4. The semiconductor device ofclaim 1, wherein the first channel is a p-type doped nanowire and thesecond channel is an n-type doped nanowire.
 5. The semiconductor deviceof claim 1, wherein a lower insulating sub-layer is formed between thecharge storage layer and the channel, and is thin enough for tunnelingto be possible.
 6. The semiconductor device of claim 1, wherein thecharge storage layer comprises a plurality of conductive particles. 7.The semiconductor device of claim 6, wherein the conductive particlesare nanoparticles.
 8. The semiconductor device of claim 1, wherein aforward bias or a reverse bias is applied to the control gate to controlthe operating characteristics of the semiconductor device.
 9. Thesemiconductor device of claim 1, wherein a negative charge is charged inat least one part of the charge storage layer when a forward bias isapplied to the control gate.
 10. The semiconductor device of claim 1,wherein a positive charge is charged in at least one part of the chargestorage layer when reverse bias is applied to the control gate.
 11. Thesemiconductor device of claim 1, wherein at least one of the controlgates includes a first control gate corresponding with the first channeland a second control gate corresponding with the second channel.
 12. Asemiconductor device comprising: an operating gate; at least a first andsecond channels formed above the operating gate and insulated from theoperating gate, and wherein both the first and second channels have afirst end and a second end; a first terminal electrode adapted to coupletogether the first end of the first channel and the first end of thesecond channel, a second terminal electrode adapted to couple togetherthe second end of the first channel and the second end of the secondchannel; a charge storage layer arranged adjacent to the first andsecond channels but insulated from the first and second channels; and atleast one control gate formed above the charge storage layer andinsulated from the charge storage layer, wherein the first channelcomprises a p-type channel and the second channel comprises an n-typechannel.
 13. The semiconductor device of claim 12, wherein an absoluteelectrical potential of the operating gate required for a current toflow above a critical value through the p-type channel is reduced when,after the application of a forward bias to the operating gate, the biasis cut off.
 14. The semiconductor device of claim 12, wherein anabsolute electrical potential of the operating gate required for acurrent to flow above a critical value through the second channel isreduced when, after the application of a reverse bias to the operatinggate, the bias is cut off.
 15. The semiconductor device of claim 12,wherein the control gate includes a first control gate correspondingwith the first channel and a second control gate corresponding with thesecond channel.
 16. The semiconductor device of claim 15, wherein aforward bias is applied to the first control gate and a reverse bias isapplied to the second control gate.
 17. The semiconductor device ofclaim 12, wherein the first channel and the second channel arenanowires.
 18. The semiconductor device of claim 12, wherein the chargestorage layer comprises a plurality of nanoparticles.
 19. A method ofmanufacturing a semiconductor device, comprising: forming a firstinsulating layer on a substrate; forming a first channel having a firstpolarity at a first planar position of the first insulating layer and asecond channel having a second polarity at a second planar position ofthe first insulating layer; forming a plurality of terminal electrodescoupled in common with the first channel and the second channel at theiropposite ends; forming a second insulating layer on the channel and theterminal electrodes; forming a charge storage layer on the secondinsulating layer that is chargeable with an electrical charge and thatcorresponds with the first planar position and the second planarposition; forming a third insulating layer on the charge storage layer;and forming an operating gate below the first insulating layer and acontrol gate on the third insulating layer.
 20. The method of claim 19,wherein the first channel and the second channel are nanowires formed ina nanowire solution.
 21. The method of claim 20 further comprisingforming a film that prevents nanowire adsorption on a remaining regionexcept for the first planar position and the second planar position. 22.The method of claim 21, wherein the film that prevents nanowireadsorption is an octadecyltrichlorosilane molecular film.
 23. The methodof claim 19, wherein the charge storage layer is formed with a pluralityof nanoparticles.
 24. The method of claim 23 further comprising forminga linker film for the adsorption of nanoparticles on at least one partof the second insulating layer.
 25. The method of claim 24, wherein thelinker film is an aminopropylethoxysilane (APTES) film.
 26. The methodof claim 19, wherein the terminal electrodes comprise gold or titanium.